Gold plating is a method of depositing a thin layer of gold on the surface of other metal, most often copper or silver.

Gold plating is often used in electronics, to provide a corrosion-resistant electrically conductive layer on copper, typically in electrical connectors and printed circuit boards. With direct gold-on-copper plating, the copper atoms have the tendency to diffuse through the gold layer, causing tarnishing of its surface and formation of an oxide/sulfide layer. A layer of a suitable barrier metal, usually nickel, has therefore to be deposited on the copper substrate, forming a copper-nickel-gold sandwich.

Metals may also be coated with gold for ornamental purposes, using a number of different processes usually referred to as gilding.

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    SMC-114          SMC-111         SMC-110          SMC-109          SMC-108

    SMC-104          SMC-101         SMC-100          SMC-093          SMC-092

    SMC-067          SMC-066         SMC-065          SMC-064          SMC-063

    SMC-062          SMC-061         SMC-054          SMC-049          SMC-015

    SMC-012B