Gold plating is a method of depositing a thin layer of gold on the surface of other metal, most often copper or silver.
Gold plating is often used in electronics, to provide a corrosion-resistant electrically conductive layer on copper, typically in electrical connectors and printed circuit boards. With direct gold-on-copper plating, the copper atoms have the tendency to diffuse through the gold layer, causing tarnishing of its surface and formation of an oxide/sulfide layer. A layer of a suitable barrier metal, usually nickel, has therefore to be deposited on the copper substrate, forming a copper-nickel-gold sandwich.
Metals may also be coated with gold for ornamental purposes, using a number of different processes usually referred to as gilding.
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SMC-114 SMC-111 SMC-110 SMC-109 SMC-108
SMC-104 SMC-101 SMC-100 SMC-093 SMC-092
SMC-067 SMC-066 SMC-065 SMC-064 SMC-063
SMC-062 SMC-061 SMC-054 SMC-049 SMC-015
SMC-012B
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