Gold plating is a method of depositing a thin layer of gold on the surface of other metal, most often copper or silver.

Gold plating is often used in electronics, to provide a corrosion-resistant electrically conductive layer on copper, typically in electrical connectors and printed circuit boards. With direct gold-on-copper plating, the copper atoms have the tendency to diffuse through the gold layer, causing tarnishing of its surface and formation of an oxide/sulfide layer. A layer of a suitable barrier metal, usually nickel, has therefore to be deposited on the copper substrate, forming a copper-nickel-gold sandwich.

Metals may also be coated with gold for ornamental purposes, using a number of different processes usually referred to as gilding.