Gold plating is a method of depositing a thin layer of gold on the surface of other metal, most often copper or silver.

Gold plating is often used in electronics, to provide a corrosion-resistant electrically conductive layer on copper, typically in electrical connectors and printed circuit boards. With direct gold-on-copper plating, the copper atoms have the tendency to diffuse through the gold layer, causing tarnishing of its surface and formation of an oxide/sulfide layer. A layer of a suitable barrier metal, usually nickel, has therefore to be deposited on the copper substrate, forming a copper-nickel-gold sandwich.

Metals may also be coated with gold for ornamental purposes, using a number of different processes usually referred to as gilding.

stainless steel gold plated cufflink

    SCF-250          SCF-240            SCF-238           SCF-234          SCF-233

    SCF-231          SCF-229            SCF-228           SCF-227          SCF-225

    SCF-224          SCF-223            SCF-221           SCF-220          SCF-219

    SCF-217          SCF-209            SCF-201           SCF-197          SCF-196

    SCF-195          SCF-193            SCF-190           SCF-188          SCF-186

    SCF-184          SCF-183            SCF-181           SCF-179          SCF-177

    SCF-175          SCF-173            SCF-171           SCF-169          SCF-166

    SCF-165          SCF-164            SCF-163           SCF-162          SCF-161

    SCF-160A        SCF-157          SCF-155           SCF-154          SCF-150A

   SCF-146A        SCF-145A          SCF-143          SCF-140          SCF-135

    SCF-095         SCF-077A         SCF-066B       SCF-066A       SCF-056A

    SCF-053A        SCF-039           SCF-036        SCF-003A